Bipolar transistors

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MOSFETs

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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

74HCS139-Q100

Dual 2-to-4 line decoder/demultiplexer with Schmitt-trigger inputs

The 74HCS139-Q100 decodes two binary weighted address inputs (nA0, nA1) to four mutually exclusive outputs (nY0 to nY3). Each decoder features an enable input (nE). When nE is HIGH all outputs are forced HIGH. The enable input can be used as the data input for a 1-to-4 demultiplexer application. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 2.0 V to 6.0 V

  • Schmitt-trigger inputs
  • Low power consumption
    • Typical supply current (ICC) of 100 nA
    • Typical input leakage current (II) of ±10 nA
  • ±7.8 mA output drive at 6 V

  • Demultiplexing capability

  • 2 independent 2-to-4 decoders

  • Multifunction capability

  • Suitable for memory decoding, data routing or code conversion

  • Active LOW mutually exclusive outputs

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Complies with JEDEC standards:
    • JESD7A (2.0 V to 6.0 V)

  • ESD protection:

    • HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V

    • CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints

Parametrics

Type number VCC (V) Logic switching levels Power dissipation considerations Tamb (°C) Package name
74HCS139BQ-Q100 2.0 - 6.0 CMOS low -40~125 DHVQFN16
74HCS139D-Q100 2.0 - 6.0 CMOS low -40~125 SO16
74HCS139PW-Q100 2.0 - 6.0 CMOS low -40~125 TSSOP16

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74HCS139BQ-Q100 74HCS139BQ-Q100X
(935692388115)		 Active S139 SOT763-1
DHVQFN16
(SOT763-1) 		SOT763-1 SOT763-1_115
74HCS139D-Q100 74HCS139D-Q100J
(935692474118)		 Active 74HCS139D SOT109-1
SO16
(SOT109-1) 		SOT109-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT109-1_118
74HCS139PW-Q100 74HCS139PW-Q100J
(935692386118)		 Active S139 SOT403-1
TSSOP16
(SOT403-1) 		SOT403-1 SSOP-TSSOP-VSO-WAVE
SOT403-1_118

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
74HCS139BQ-Q100 74HCS139BQ-Q100X 74HCS139BQ-Q100 rohs rhf rhf
74HCS139D-Q100 74HCS139D-Q100J 74HCS139D-Q100 rohs rhf rhf
74HCS139PW-Q100 74HCS139PW-Q100J 74HCS139PW-Q100 rohs rhf rhf
Quality and reliability disclaimer

Documentation (17)

File name Title Type Date
74HCS139_Q100 Dual 2-to-4 line decoder/demultiplexer with Schmitt-trigger inputs Data sheet 2025-10-24
AN90063 Questions about package outline drawings Application note 2025-10-22
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
74hcs139 74HCS139 IBIS model IBIS model 2025-10-26
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN16_SOT763-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body Marcom graphics 2017-01-28
SO16_SOT109-1_mk plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body Marcom graphics 2017-01-28
TSSOP16_SOT403-1_mk plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT763-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body Package information 2023-05-11
SOT109-1 plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT403-1 plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-08
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

Support

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Models

File name Title Type Date
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
74hcs139 74HCS139 IBIS model IBIS model 2025-10-26

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