Features and benefits
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Balanced propagation delays
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All inputs have Schmitt-trigger actions
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Inputs accept voltages higher than VCC
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Input levels:
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For 74AHC30: CMOS level
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For 74AHCT30: TTL level
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
Parametrics
| Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC30BQ | Production | 2.0 - 5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | 108 | 22.7 | 76 | DHVQFN14 |
| 74AHC30D | Production | 2.0 - 5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | 111 | 21.9 | 69 | SO14 |
| 74AHC30GU12 | Production | 2.0 - 5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | - | - | - | XQFN12 |
| 74AHC30PW | Production | 2.0 - 5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | 143 | 8.5 | 69 | TSSOP14 |
| 74AHCT30BQ | Production | 4.5 - 5.5 | TTL | ± 8 | 3.3 | 60 | 1 | low | -40~125 | 108 | 22.7 | 76 | DHVQFN14 |
| 74AHCT30D | Production | 4.5 - 5.5 | TTL | ± 8 | 3.3 | 60 | 1 | low | -40~125 | 111 | 21.9 | 69 | SO14 |
| 74AHCT30PW | Production | 4.5 - 5.5 | TTL | ± 8 | 3.3 | 60 | 1 | low | -40~125 | 143 | 8.5 | 69 | TSSOP14 |
Package
| Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
|---|---|---|---|---|---|---|---|
| 74AHC30BQ |  DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | AHC30 | 74AHC30BQ,115 ( 9352 897 64115 ) | |
| 74AHC30D |  SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_118 | Active | 74AHC30D | 74AHC30D,118 ( 9352 641 86118 ) |
| 74AHC30GU12 |  XQFN12 (SOT1174-1) | SOT1174-1 | SOT1174-1_115 | Active | Standard Marking | 74AHC30GU12X ( 9353 060 68115 ) | |
| 74AHC30PW |  TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | AHC30 | 74AHC30PW,118 ( 9352 641 87118 ) |
| 74AHCT30BQ | DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | AHT30 | 74AHCT30BQ,115 ( 9352 897 65115 ) | |
| 74AHCT30D | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_118 | Active | 74AHCT30D | 74AHCT30D,118 ( 9352 641 84118 ) |
| 74AHCT30PW | TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | AHCT30 | 74AHCT30PW,118 ( 9352 641 85118 ) |
Discontinuation information
| Type number | Orderable part number, (Ordering code (12NC)) | Last time buy date | Last time delivery date | Replacement product | Status | Comments |
|---|---|---|---|---|---|---|
| 74AHC30D | 935264186112 | 2021-12-31 | 2022-06-30 | 74AHC30D | ||
| 74AHC30PW | 935264187112 | 2021-12-31 | 2022-06-30 | 74AHC30PW | ||
| 74AHCT30D | 935264184112 | 2018-12-31 | 2019-06-30 | 74AHCT30D | ||
| 74AHCT30PW | 935264185112 | 2018-12-31 | 2019-06-30 | 74AHCT30PW |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
|---|---|---|---|---|---|
| 74AHC30BQ | 74AHC30BQ,115 | 74AHC30BQ |  |   | Always Pb-free |
| 74AHC30D | 74AHC30D,118 | 74AHC30D | | | week 32, 2004 |
| 74AHC30GU12 | 74AHC30GU12X | 74AHC30GU12 | | | Always Pb-free |
| 74AHC30PW | 74AHC30PW,118 | 74AHC30PW | | | week 10, 2005 |
| 74AHCT30BQ | 74AHCT30BQ,115 | 74AHCT30BQ | | | Always Pb-free |
| 74AHCT30D | 74AHCT30D,118 | 74AHCT30D | | | week 32, 2004 |
| 74AHCT30PW | 74AHCT30PW,118 | 74AHCT30PW | | | week 10, 2005 |
Documentation (11)
| File name | Title | Type | Date |
|---|---|---|---|
| 74AHC_AHCT30 | 8-input NAND gate | Data sheet | 2023-10-09 |
| ahct30 | 74AHCT30 IBIS model | IBIS model | 2015-08-30 |
| ahc30 | 74AHC30 IBIS model | IBIS model | 2015-08-30 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | Package information | 2022-06-07 |
Support
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Ordering, pricing & availability
Sample
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